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M68AW064F 1 Mbit (64K x16) 3.0V Asynchronous SRAM FEATURES SUMMARY s SUPPLY VOLTAGE: 2.7 to 3.6V s s Figure 1. Packages 64K x 16 bits SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIME: 55ns and 70ns LOW STANDBY CURRENT LOW VCC DATA RETENTION: 2.0V TRI-STATE COMMON I/O AUTOMATIC POWER DOWN TFBGA48 (ZB) 6 x 8 solder balls BGA s s s s April 2003 1/18 M68AW064F TABLE OF CONTENTS SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 3. TFBGA Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 2. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 5. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 6. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 7. Address Controlled, Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 8. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms. . . . . . . . . . . . . . . 9 Figure 9. Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms . . . . . . . . . . . . . . . . . . 9 Table 7. Read and Standby Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 10. Write Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 11. Chip Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 8. Write Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 12. Low V CC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 9. Low V CC Data Retention Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 TFBGA48 - 6 x 8 ball array, 0.75 mm pitch, Bottom View Package Outline . . . . . . . . . . . . . . . . . . 15 TFBGA48 - 6 x 8 ball array, 0.75 mm pitch, Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . 15 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 11. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 12. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/18 M68AW064F SUMMARY DESCRIPTION The M68AW064F is a 1 Mbit (1,048,576 bit) CMOS SRAM, organized as 65,536 words by 16 bits. The device features fully static operation requiring no external clocks or timing strobes, with equal address access and cycle times. It requires a single 2.7 to 3.6V supply. This device has an au- tomatic power-down feature, reducing the power consumption by over 99% when deselected. The M68AW064F is available in TFBGA48 (0.75 mm pitch) package. Figure 2. Logic Diagram VCC Table 1. Signal Names A0-A15 DQ0-DQ15 Address Inputs Data Input/Output Chip Enable Output Enable Write Enable Upper Byte Enable Input Lower Byte Enable Input Supply Voltage Ground Not Connected Internally 16 A0-A15 W 16 DQ0-DQ15 E G W UB E G UB LB M68AW064F LB VCC VSS NC VSS AI04872b 3/18 M68AW064F Figure 3. TFBGA Connections (Top view through package) 1 2 3 4 5 6 A LB G A0 A1 A2 NC B DQ8 UB A3 A4 E DQ0 C DQ9 DQ10 A5 A6 DQ1 DQ2 D VSS DQ11 NC A7 DQ3 VCC E VCC DQ12 NC NC DQ4 VSS F DQ14 DQ13 A14 A15 DQ5 DQ6 G DQ15 NC A12 A13 W DQ7 H NC A8 A9 A10 A11 NC AI04874 4/18 M68AW064F Figure 4. Block Diagram VCC VSS ROW DECODER A7 MEMORY ARRAY A15 DQ15 UB (8) I/O CIRCUITS COLUMN DECODER DQ0 LB (8) A0 (8) W E (8) LB G UB A6 UB LB AI04875 MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not imTable 2. Absolute Maximum Ratings Symbol IO (1) TA TSTG VCC VIO (2) PD Output Current Ambient Operating Temperature Storage Temperature Supply Voltage Input or Output Voltage Power Dissipation Parameter plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Value 20 -55 to 125 -65 to 150 -0.5 to 4.6 -0.5 to VCC +0.5 1 Unit mA C C V V W Note: 1. One output at a time, not to exceed 1 second duration. 2. Up to a maximum operating VCC of 3.6V only. 5/18 M68AW064F DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC Characteristic tables are derived from tests performed under the Measure- ment Conditions listed in the relevant tables. Designers should check that the operating conditions in their projects match the measurement conditions when using the quoted parameters. Table 3. Operating and AC Measurement Conditions Parameter VCC Supply Voltage Ambient Operating Temperature Load Capacitance (CL) Output Circuit Protection Resistance (R1) Load Resistance (R2) Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages Input and Output Transition Timing Ref. Voltages M68AW064F 2.7 to 3.6V -40 to 85C 30 or 5pF 1.10k 1.55k 4ns 0 to VCC VCC/2 VOL = 0.3VCC; VOH = 0.7VCC Figure 5. AC Measurement I/O Waveform Figure 6. AC Measurement Load Circuit VCC I/O Timing Reference Voltage VCC VCC/2 0V DEVICE UNDER TEST 1N914 R1 OUT CL R2 I/O Transition Timing Reference Voltage VCC 0.7VCC 0.3VCC AI04831 0V CL includes JIG capacitance AI03853 6/18 M68AW064F Table 4. Capacitance Symbol CIN COUT (3) Parameter(1,2) Input Capacitance on all pins (except DQ) Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 8 Unit pF pF Note: 1. Sampled only, not 100% tested. 2. At TA = 25C, f = 1 MHz, VCC = 3.0V. 3. Outputs deselected. Table 5. DC Characteristics M68AW064F Symbol Parameter Test Condition Min ICC1 (1) ICC2 ISB (2) ILI ILO VIH VIL VOH VOL Operating Supply Current Operating Supply Current Standby Supply Current CMOS Input Leakage Current Output Leakage Current Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage VCC = 3.6V, f = 1/tAVAV, IOUT = 0mA VCC = 3.6V, f = 1MHz, IOUT = 0mA VCC = 3.6V, E VCC -0.15V, f = 0 0V VIN VCC 0V VOUT VCC (3) VCC = 2.7V VCC = 2.7V VCC = 2.7V, IOH = -1.0mA VCC = 2.7V, IOL = 2.1mA -1 -1 2.0 -0.3 2.2 0.4 55 Typ 7 1 0.5 Max 20 2 15 1 1 VCC + 0.3 0.4 -1 -1 2.0 -0.3 2.2 0.4 1 0.5 Min 70 Typ Max 15 2 15 1 1 VCC + 0.3 0.4 mA mA A A A V V V V Unit Note: 1. Average AC current, cycling at tAVAV minimum. 2. All other Inputs at V IL 0.15V or V IH V CC -0.15V. 3. Output disabled. 7/18 M68AW064F OPERATION The M68AW064F has a Chip Enable power down feature which invokes an automatic standby mode whenever either Chip Enable is de-asserted (E = High) or LB and UB are de-asserted (LB and UB = High). An Output Enable (G) signal provides Table 6. Operating Modes Operation Deselected/Power-down Deselected/Power-down Lower Byte Read Lower Byte Write Output Disabled Output Disabled Upper Byte Read Upper Byte Write Word Read Word Write Note: 1. X = VIH or VIL. a high speed tri-state control, allowing fast read/ write cycles to be achieved with the common I/O data bus. Operational modes are determined by device control inputs W, E, LB and UB as summarized in the Operating Modes table (see Table 6). E VIH X VIL VIL VIL VIL VIL VIL VIL VIL W X X VIH VIL X X VIH VIL VIH VIL G X X VIL X VIH VIH VIL X VIL X LB X VIH VIL VIL VIL X VIH VIH VIL VIL UB X VIH VIH VIH X VIL VIL VIL VIL VIL DQ0-DQ7 Hi-Z Hi-Z Data Output Data Input Hi-Z Hi-Z Hi-Z Hi-Z Data Output Data Input DQ8-DQ15 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Data Output Data Input Data Output Data Input Power Standby (ISB) Standby (ISB) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Read Mode The M68AW064F is in the Read mode whenever Write Enable (W) is High with Output Enable (G) Low, and Chip Enable (E) is asserted. This provides access to data from eight or sixteen, depending on the status of the signal UB and LB, of the 1,048,576 locations in the static memory array, specified by the 16 address inputs. Valid data will be available at the eight or sixteen output pins within t AVQV after the last stable address, providing G is Low and E is Low. If Chip Enable or Output Enable access times are not met, data access will be measured from the limiting parameter (tELQV, tGLQV or t BLQV) rather than the address. Data out may be indeterminate at tELQX, tGLQX and tBLQX but data lines will always be valid at tAVQV. Figure 7. Address Controlled, Read Mode AC Waveforms tAVAV A0-A15 tAVQV VALID tAXQX DQ0-DQ15 DATA VALID AI04876 Note: E = Low, G = Low, W = High, UB = Low and/or LB = Low. 8/18 M68AW064F Figure 8. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms. tAVAV A0-A15 tAVQV tELQV E tELQX tGLQV G tGLQX DQ0-DQ15 tBLQV UB, LB tBLQX AI04877 VALID tAXQX tEHQZ tGHQZ VALID tBHQZ Note: Write Enable (W) = High. Figure 9. Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms E, UB, LB ICC ISB tPU 50% tPD AI03856 9/18 M68AW064F Table 7. Read and Standby Mode AC Characteristics M68AW064F Symbol Parameter Min. tAVAV tAVQV tAXQX tBHQZ (1, 2) tBLQV tBLQX tEHQZ (1, 2) tELQV tELQX tGHQZ (1, 2) tGLQV tGLQX tPD tPU Read Cycle Time Address Valid to Output Valid Data hold from address change Upper/Lower Byte Enable High to Output Hi-Z Upper/Lower Byte Enable Low to Output Valid Upper/Lower Byte Enable Low to Output Transition Chip Enable High to Output Hi-Z Chip Enable Low to Output Valid Chip Enable Low to Output Transition Output Enable High to Output Hi-Z Output Enable Low to Output Valid Output Enable Low to Output Transition Chip Enable or UB/LB High to Power Down Chip Enable or UB/LB Low to Power Up 0 5 55 0 10 20 25 5 70 5 20 55 10 25 35 10 20 25 5 25 70 55 55 10 25 35 55 Max. Min. 70 70 70 Max. ns ns ns ns ns ns ns ns ns ns ns ns ns ns Unit Note: 1. At any given temperature and voltage condition, t GHQZ is less than tGLQX , tBHQZ is less than tBLQX and t EHQZ is less than tELQX for any given device. 2. CL = 5pF. 10/18 M68AW064F Write Mode The M68AW064F is in the Write mode whenever the W and E are Low. Either the Chip Enable input (E) or the Write Enable input (W) must be deasserted during Address transitions for subsequent write cycles. When E (W) is Low, and UB or LB is Low, write cycle begins on the W (E)'s falling edge. Therefore, address setup time is referenced to Write Enable as tAVWL and to Chip Enable as tAVEL and is determined by the latter occurring edge. The Write cycle can be terminated by the earlier rising edge of E or W. If the Output is enabled (E = Low, G = Low, LB or UB = Low), then W will return the outputs to high impedance within t WLQZ of its falling edge. Care must be taken to avoid bus contention in this type of operation. Data input must be valid for tDVWH before the rising edge of Write Enable, or for tDVEH before the rising edge of E, whichever occurs first, and remain valid for t WHDX and tEHDX respectively. Figure 10. Write Enable Controlled, Write AC Waveforms tAVAV A0-A15 VALID tAVWH tAVEL E tWLWH tAVWL W tWLQZ tWHDX DQ0-DQ15 DATA INPUT tDVWH tBLWH UB, LB AI04878 tWHAX tWHQX 11/18 M68AW064F Figure 11. Chip Enable Controlled, Write AC Waveforms tAVAV A0-A15 VALID tAVEH tAVEL E tAVWL W tEHDX DQ0-DQ15 DATA INPUT tDVEH tBLEH UB, LB AI04879 tELEH tEHAX 12/18 M68AW064F Table 8. Write Mode AC Characteristics M68AW064F Symbol Parameter Min tAVAV tAVEH tAVEL tAVWH tAVWL tBLEH tBLWH tDVEH tDVWH tEHAX tEHDX tELEH tWHAX tWHDX tWHQX (1) tWLQZ (1,2) tWLWH Write Cycle Time Address Valid to Chip Enable High Address valid to Chip Enable Low Address Valid to Write Enable High Address Valid to Write Enable Low LB, UB Low to Chip Enable High LB, UB Low to Write Enable High Input Valid to Chip Enable High Input Valid to Write Enable High Chip Enable High to Address Transition Chip enable High to Input Transition Chip Enable Low to Chip Enable High Write Enable High to Address Transition Write Enable High to Input Transition Write Enable High to Output Transition Write Enable Low to Output Hi-Z Write Enable Low to Write Enable High 40 55 45 0 45 0 45 45 25 25 0 0 45 0 0 5 25 50 55 Max Min 70 60 0 60 0 60 60 30 30 0 0 60 0 0 5 25 70 Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Unit Note: 1. At any given temperature and voltage condition, tWLQZ is less than tWHQX for any given device. 2. CL = 5pF. 13/18 M68AW064F Figure 12. Low VCC Data Retention AC Waveforms DATA RETENTION MODE 3.6V VCC 3.3V VDR > 2.0V tCDR E VDR - 0.2V E tR AI04885 Table 9. Low V CC Data Retention Characteristics Symbol Parameter Test Condition VCC = 2.0V, E VCC -0.3V, f = 0 (3) E VCC -0.3V, f = 0 tAVAV 0 E VCC -0.3V, f = 0 2.0 3.6 Min Typ 0.5 Max 15 Unit A ns ns V ICCDR (1) Supply Current (Data Retention) tCDR (1,2) tR (2) VDR (1) Chip Deselected to Data Retention Time Operation Recovery Time Supply Voltage (Data Retention) Note: 1. All other Inputs at V IH VCC -0.2V or VIL 0.2V. 2. See Figure 12 for measurement points. Guaranteed but not tested. tAVAV is Read cycle time. 3. No input may exceed VCC +0.3V. 14/18 M68AW064F PACKAGE MECHANICAL Figure 13. TFBGA48 - 6 x 8 ball array, 0.75 mm pitch, Bottom View Package Outline D FD FE SD D1 SE BALL "A1" E E1 ddd e e A A1 b A2 BGA-Z26 Note: Drawing is not to scale. Table 10. TFBGA48 - 6 x 8 ball array, 0.75 mm pitch, Package Mechanical Data Symbol A A1 A2 b D D1 ddd E E1 e FD FE SD SE 8.000 5.250 0.750 1.125 1.375 0.375 0.375 7.900 - - - - - - 6.000 3.750 0.350 5.900 - 0.260 0.900 0.450 6.100 - 0.100 8.100 - - - - - - 0.3150 0.2067 0.0295 0.0443 0.0541 0.0148 0.0148 0.3110 - - - - - - 0.2362 0.1476 0.0138 0.2323 - millimeters Typ Min Max 1.200 0.0102 0.0354 0.0177 0.2402 - 0.0039 0.3189 - - - - - - Typ inches Min Max 0.0472 15/18 M68AW064F PART NUMBERING Table 11. Ordering Information Scheme Example: Device Type M68 Mode A = Asynchronous Operating Voltage W = 2.7 to 3.6V Array Organization 064 = 1 Mbit (64K x16) Option 1 F = 1 Chip Enable; Standby from UB and LB Option 2 L = Low Leakage Speed Class 55 = 55ns 70 = 70ns Package ZB = TFBGA48: 0.75 mm pitch Operative Temperature 6 = -40 to 85 C Shipping T = Tape & Reel Packing M68AW064F L 55 ZB 6 T For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 16/18 M68AW064F REVISION HISTORY Table 12. Document Revision History Date July 2001 Version -01 First Issue Revision numbering modified: a minor revision will be indicated by incrementing the digit after the dot, and a major revision, by incrementing the digit before the dot (revision version 01 equals 1.0). Part number modified. 55ns speed class added. Maximum Standby Supply Current ISB modified. Values of certain AC Characteristics modified. Revision Details 09-Oct-2002 1.1 23-Apr-2003 1.2 17/18 M68AW064F Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics All other names are the property of their respective owners (c) 2003 STMicroelectronics - All Rights Reserved STMicroelectronics group of companies Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. www.st.com 18/18 |
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